Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same
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United States of America Patent
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Oct 11, 2022
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N/A
app pub date -
Aug 30, 2021
filing date -
Aug 23, 2019
priority date (Note) -
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Abstract
A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having a 1.2 or more aspect ratio in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.
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