Substrate with embedded free space optical interconnects
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United States of America Patent
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Dec 7, 2004
Grant Date -
Oct 21, 2004
app pub date -
Apr 15, 2003
filing date -
Apr 15, 2003
priority date (Note) -
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Abstract
Substrates with embedded free space light guiding channels for optical interconnects, and methods for making such substrates are shown. The method comprising steps of a groove in a first generally planar body, and combining the first body with a second generally planar body to form the substrate, and providing input and output ports to enable light to travel into and out of the groove. The first and second bodies may be made of silicon, polymers or combinations of the two. Additional generally planar bodies may be incorporated to provide for complex, 3D optical signal routing within the substrate.
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