Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
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United States of America Patent
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Sep 4, 2007
Grant Date -
Jul 28, 2005
app pub date -
Dec 21, 2004
filing date -
Jan 21, 2004
priority date (Note) -
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Abstract
Aspects of the invention can provide an alignment method that is preferably applicable when manufacturing equipments by liquid-phase processing. The alignment method in a device manufacturing process can include forming of a functional film on a substrate by liquid-phase processing, forming an alignment mark on the substrate on which the functional film is formed so as to make a pattern of the alignment mark appear on a film that is formed after forming the functional film, and aligning the film that is formed after forming the functional film by using the alignment mark.
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