Multi-layer printed circuit board and fabricating method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 13, 2007
Grant Date -
May 12, 2005
app pub date -
Nov 5, 2004
filing date -
Nov 6, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A fabricating method for a multi-layer printed circuit board is provided. The method may include attaching a releasing film at upper and lower surfaces of a center layer and attaching a first metal film to each of the releasing films and a resist layer to each of the first metal films to form a base member. A first connection portion may then be formed on each of the first metal films, and a second connection portion may be integrally formed on each of the first connection portions. A second metal film may then be formed on each of the second connection portions so as to be electrically connected to the connection portions, and, in turn, to the first metal films. Specific portions of the second metal films may be etched to form copper patterns. Upper and lower portions may then be separated by the releasing films to form separate multi-layer printed circuit boards.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully