Flip-chip bonding of light emitting devices
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United States of America Patent
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Aug 21, 2007
Grant Date -
Jan 27, 2005
app pub date -
Aug 17, 2004
filing date -
Jul 23, 2001
priority date (Note) -
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Abstract
Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- CREE, INC.;CREE MICROWAVE, LLC
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Andrews, Peter S | Greensboro, NC | 53 | 1543 |
Bharathan, Jayesh | Santa Barbara, CA | 16 | 702 |
Edmond, John | Cary, NC | 48 | 1942 |
Mohammed, Anwar | San Jose, CA | 57 | 338 |
Negley, Gerald H | Hillsborough, NC | 251 | 15928 |
Raffetto, Mark | Santa Barbara, CA | 7 | 169 |
Slater, Jr David B | Raleigh, NC | 32 | 1805 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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