Low k dielectric insulator and method of forming semiconductor circuit structures
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United States of America Patent
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Apr 15, 2003
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N/A
app pub date -
Aug 31, 2000
filing date -
Aug 31, 2000
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Abstract
A porous insulator material and method of manufacturing. The material comprises oxygen, silicon and hydrogen characterized by a density less than 2 g/cc. Alternately, the porous insulator material is characterized by a refractive index less than 1.45 for light at a wavelength between 633 nm and 673 nm, or by a Young's modulus less than 45 GPa. A method for manufacturing a semiconductor device includes providing a semiconductor layer with an upper surface for device formation and forming multiple levels of interconnect over the semiconductor layer, each level including a plurality of members. The members are electrically isolated from other members by decomposition of TEOS to form a porous layer between at least some of the members.
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