Method for manufacturing a substrate-for-wiring/ wiring harness
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United States of America Patent
Stats
-
Feb 17, 2004
Issued Date -
N/A
app pub date -
Apr 2, 2002
filing date -
Jul 7, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Method for manufacturing a wiring harness or a substrate for wiring wherein the wiring diagram applied to the substrate is based on the wiring harness information. Entities representing connectors, binding parts, and wiring length information of wirings are input. The wiring arrangement diagram includes lines that correspond to the wirings and do not have a length corresponding to actual length of the wirings. The wiring harness is made using the information including total length of wiring between each of the connectors, harness information generated based on the entities, and the length information of the desired wiring arrangement. Alternatively, the wiring harness information is used to draw a wiring diagram for fixing on the substrate.
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