Film type package for fingerprint sensor
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United States of America Patent
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-
May 3, 2011
Grant Date -
Apr 10, 2008
app pub date -
Mar 23, 2007
filing date -
Oct 5, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film with a plurality of leads and at least an encapsulant to encapsulate the bumps. A sensing area is formed on an active surface of the fingerprint sensor chip. The bumps are disposed on the active surface and located at two opposing sides of the sensing area. The wiring film has an opening to expose the sensing area. Each lead has an inner end and an outer end. The inner ends are located at two opposing sides of the opening and are bonded to the bumps. Preferably, the wiring film has a flexible extension and the outer ends of the leads are rerouted to the extension for external electrical connections.
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