Probe for inspecting semiconductor device and method of manufacturing the same
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United States of America Patent
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-
Dec 23, 2003
Grant Date -
Sep 12, 2002
app pub date -
Mar 5, 2002
filing date -
Mar 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe is provided so as to obtain an electrical contact between a semiconductor device having a plurality of first electrodes as external terminals and an inspection substrate having a plurality of second electrodes so as to inspect the semiconductor device. A first substrate has through holes formed at positions corresponding to the first electrodes. Probe pins are fixed in the through holes. A second substrate has a rewiring layer for extending a pitch of the first electrodes and penetration electrodes for drawing out the first electrodes to a back surface. A contact is disposed between the penetration electrodes and the second electrodes and has conductivity and elasticity only in a vertical direction.
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