Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument
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United States of America Patent
Stats
-
Mar 7, 2006
Grant Date -
Feb 24, 2005
app pub date -
Aug 17, 2004
filing date -
Oct 1, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device comprising a substrate. An interconnect pattern is formed over the substrate, and the substrate has a first portion and a second portion to be superposed on the first portion. The first portion has edges as positioning references. The second portion has a shape to be superposed over the first portion except the edges.
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