Package type semiconductor device
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United States of America Patent
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-
Mar 7, 2006
Grant Date -
Apr 14, 2005
app pub date -
Oct 8, 2004
filing date -
Oct 10, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer for connecting to a second region of the semiconductor part; a blocking member electrically isolated from the control wiring layer; a first metallic layer; a protection film disposed among the main electrode, the control wiring layer and the blocking member; and a metal block for connecting to the main electrode through the first metallic layer. The chip, the main electrode, the control wiring layer, the blocking member, and the metal block are packaged. The blocking member is disposed between the main electrode and the control wiring layer.
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