Module of stacked integrated circuit packages including an interposer
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United States of America Patent
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Jun 11, 2002
Grant Date -
N/A
app pub date -
Feb 3, 2000
filing date -
Feb 3, 2000
priority date (Note) -
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Abstract
A module of electrically interconnected integrated circuit packages and methods of making the module are disclosed. The module includes at least first and second integrated circuit packages, each of which are comprised of a package body formed of an encapsulant material. A plurality of leads extend from the package bodies of the first and second packages. The leads are bent into a C-shape. Keys and keyholes in the package bodies allow the packages to be stacked one on top of the other. One or more leads of the first package are electrically connected to one or more leads of the second package through an interposer that is positioned between the first and second packages. The interposer includes conductive paths that enable the electrical connection of leads of the first and second packages in cases where the leads to be interconnected are displaced from one and other.
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