Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11978692
APP PUB NO 20220084915A1
SERIAL NO

17471249

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Abstract

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A semiconductor package includes a semiconductor die having opposing first and second main surfaces, a first power electrode on the first main surface and a second power electrode on the second main surface, a first lead having an inner surface attached to the first power electrode and a distal end having a first protruding side face extending substantially perpendicularly to the first main surface of the die, a second lead having an inner surface attached to the second power electrode and a distal end having a second protruding side face extending substantially perpendicularly to the second main surface of the die, and a mold compound enclosing at least part of the die and at least part of the first and second leads. The first lead includes a recess positioned in an edge of the inner surface. The second lead includes a recess positioned in an edge of the inner surface.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoeglauer, Josef Heimstetten, DE 93 671
Noebauer, Gerhard Villach, AT 35 113
Yuferev, Sergey Villach, AT 12 4
Zhuang, Hao Hohenbrunn, DE 21 89

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