Process for sequential multi beam laser processing of materials
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United States of America Patent
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Jan 2, 2001
Issued Date -
N/A
app pub date -
Oct 8, 1997
filing date -
Oct 8, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of processing a substrate by first processing the substrate surface with a laser operating at a first wavelength to both evaporate a portion of the substrate and structurally weaken the substrate surface, and then by processing the substrate surface with a laser operating at a second wavelength to remove the structurally weakened surface.
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