System and method for manufacture of circuit boards
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United States of America Patent
Stats
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Aug 18, 2020
Grant Date -
Oct 24, 2019
app pub date -
Apr 16, 2019
filing date -
Apr 18, 2018
priority date (Note) -
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Abstract
Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
UNIVERSITY OF HAWAII | 2425 CAMPUS ROAD SINCLAIR 10 HONOLULU HI 96822 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Garmire, David | Ann Arbor, US | 15 | 103 |
Oyama, Tamra | Honolulu, US | 1 | 0 |
Zhou, Jie | Honolulu, US | 268 | 2403 |
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