System and method for manufacture of circuit boards

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10750618
APP PUB NO 20190327837A1
SERIAL NO

16386191

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods, systems, and apparatus for fabricating a circuit board. The method includes fabricating, using an additive manufacturing device, a trace layer, a sacrificial layer, a rail layer and a lid. The method includes placing the sacrificial layer on the trace layer such that the raised traces protrude through corresponding openings of the sacrificial layer. The method includes depositing a conductive material on top of the sacrificial layer and the plurality of traces. The method includes removing the sacrificial layer from the trace layer and placing the rail layer on the trace layer such that the raised traces align with the corresponding openings of the rail layer. The method includes connecting one or more electrical components and melting a sealing sheet on top of the rail layer and the electrical components to reinforce connections and to provide protection. The method includes placing the lid on top of the sealing sheet.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITY OF HAWAII2425 CAMPUS ROAD SINCLAIR 10 HONOLULU HI 96822

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garmire, David Ann Arbor, US 15 103
Oyama, Tamra Honolulu, US 1 0
Zhou, Jie Honolulu, US 268 2403

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