IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11984377
APP PUB NO 20210305121A1
SERIAL NO

16831068

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Al, Mohammad Ahmad Portland, US 4 9
Bozorg-Grayeli, Elah Chandler, US 13 17
Chang, Je-Young Tempe, US 64 350
Mallik, Debendra Chandler, US 178 2199
Viswanath, Ram Phoenix, US 22 135

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