Method of manufacturing a semiconductor device and apparatus for manufacturing the semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11320747
APP PUB NO 20210096475A1
SERIAL NO

17121542

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Abstract

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Photolithography apparatus includes a radiation source, a mask to modify radiation from the radiation source so the radiation exposes photoresist layer disposed on a semiconductor substrate in patternwise manner, a wafer stage, and a controller. The wafer stage supports the semiconductor substrate. The controller determines target total exposure dose for the photoresist layer and target focus position for the photoresist layer; and controls exposure of first portion of the photoresist layer to first exposure dose of radiation at first focus position using first portion of the mask, moving the semiconductor substrate relative to the mask; and exposure of the first portion of the photoresist layer to second exposure dose of radiation using second portion of the mask at second focus position, and exposure of second portion of the photoresist layer to the second exposure dose at the second focus position using the first portion of the mask.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Minfeng Hsinchu, TW 17 9
Chou, Shuo-Yen Hualien County, TW 26 728
Huang, Hsu-Ting Hsinchu, TW 39 260
Lin, Chin-Hsiang Hsinchu, TW 407 5685
Liu, Ru-Gun Zhubei, TW 388 5893
Yamazoe, Kenji Campbell, US 50 528
Yu, Shinn-Sheng Hsinchu, TW 131 3460

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