Flip-chip package structure with stiffener
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United States of America Patent
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May 26, 2009
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N/A
app pub date -
Nov 22, 2006
filing date -
Jun 30, 2006
priority date (Note) -
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Abstract
A flip-chip package structure with stiffener includes a substrate, a first stiffener positioned on a surface of the substrate, a chip having a plurality of bumps adopted to electrically connect the substrate and the chip, and a second stiffener positioned on the surface of the substrate and connected with the first stiffener. The first stiffener is positioned outside of the second stiffener.
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