Plasma processing apparatus and substrate support of plasma processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11972933
SERIAL NO

17368887

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is provided a substrate support of a plasma processing apparatus. The substrate support includes a wafer placement surface and a ring placement surface on which a first ring and a second ring disposed at an outer peripheral side of the first ring without overlapping with the first ring in a vertical direction are placed, with a hole at a boundary between the first ring and the second ring. The substrate support further includes a lifter pin having a first holding portion and a second holding portion, the second holding portion being unitary with and extending axially from a base end of the first holding portion and having a protruding portion protruding from an outer circumference of the first holding portion, and a driving mechanism configured to raise and lower the lifter pin.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dogome, Masahiro Miyagi, JP 12 12

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