Semiconductor memory devices and methods of manufacturing thereof
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United States of America Patent
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Jul 18, 2023
Grant Date -
Sep 15, 2022
app pub date -
Sep 9, 2021
filing date -
Mar 12, 2021
priority date (Note) -
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Abstract
A semiconductor device comprises a first conductive structure extending along a vertical direction and a second conductive structure extending along the vertical direction. The second conductive structure is spaced apart from the first conductive structure along a lateral direction. The semiconductor device further comprises a plurality of third conductive structures each extending along the lateral direction. The plurality of third conductive structures are disposed across the first and second conductive structures. The first and second conductive structures each have a varying width along the lateral direction. The plurality of third conductive structures are configured to be applied with respective different voltages in accordance with the varying width of the first and second conductive structures.
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