Method for supporting semiconductor wafer and wafer supporting assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8776363
APP PUB NO 20130312246A1
SERIAL NO

13479253

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Abstract

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A method for supporting a semiconductor wafer includes providing a device wafer to a magnetizable ring, providing a magnetizable carrier to the device wafer, and magnetizing the magnetizable ring and the magnetizable carrier to form a magnetized clamp having a magnetized ring and magnetized carrier. The magnetized clamp securely clamps the device wafer therebetween.

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Patent Owner(s)

  • UNITED MICROELECTRONICS CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Li-Che Pingtung County, TW 29 203
Chen, Yan-Da Taipei, TW 16 12
Hsu, Chang-Sheng Hsinchu, TW 21 61
Lien, Chia-Wen Taoyuan County, TW 7 8
Yang, Kuo-Yuh Hsinchu County, TW 44 46

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