Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies

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United States of America Patent

PATENT NO 11410961
SERIAL NO

16821536

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Abstract

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This patent application relates to methods and apparatus for temperature modification within a stack of microelectronic devices for mutual collective bonding of the microelectronic devices, and to related substrates and assemblies.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bayless, Andrew M Boise, US 43 39
Wirz, Brandon P Boise, US 53 86

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