Void-free damascene copper deposition process and means of monitoring thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 16, 2010
Issued Date -
N/A
app pub date -
Jul 10, 2003
filing date -
Jul 10, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating baths. More particularly, the present invention relates to the stability of copper plating baths. More particularly, the present invention relates to prevention of void formation by monitoring the accumulation of deleterious by-products in copper plating baths.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully