Method of producing a package for semiconductor chips
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United States of America Patent
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-
Feb 5, 2008
Grant Date -
Sep 21, 2006
app pub date -
Jul 4, 2002
filing date -
Jul 10, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The inventive method is based on the a idea of releasing a mechanical connection between the semiconductor chip and the supporting substrate during the manufacturing of the packing. The mechanical connection required for producing the electrical contacts between the semiconductor chip and the supporting substrate ensues only temporarily. As a result, a critical interface in the packing is removed thereby resulting in distinctly reducing the thermomechanical stresses.
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