Under bump metalization pad and solder bump connections
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United States of America Patent
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May 27, 2003
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N/A
app pub date -
Sep 2, 1999
filing date -
Sep 2, 1999
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Abstract
The present invention relates to an improved method of forming and structure for under bump metallurgy ('UBM') pads for a flip chip which reduces the number of metal layers and requires the use of only a single passivation layer to form, thus eliminating a masking step required in typical prior art processes. The method also includes repatterning bond pad locations.
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