Substrate for mounting semiconductor element and method of manufacturing the same
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United States of America Patent
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May 11, 2010
Grant Date -
Sep 11, 2008
app pub date -
Mar 5, 2008
filing date -
Mar 8, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrate 1; a plurality of wiring patterns 3 formed on the base substrate 1 and connected to the semiconductor element 11; and a dummy pattern 8 formed like a frame in the region 2 for mounting the semiconductor element 11 and not connected to the wiring patterns 3.
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