Process condition sensing wafer and data analysis system
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United States of America Patent
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Jul 20, 2010
Grant Date -
Aug 10, 2006
app pub date -
Dec 13, 2005
filing date -
Jan 24, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
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