Resin molding system and resin molding method
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United States of America Patent
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Jul 25, 2023
Grant Date -
N/A
app pub date -
Dec 26, 2019
filing date -
Dec 28, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A resin molding system 1 comprises a gripping device 3 provided with a gripping frame 30 for gripping a resin sheet material 2, a heating device for heating the resin sheet material 2 and a molding device for clamping a lower die 61 and an upper die, and affixing the resin sheet material 2 to a substrate 63. The molding device is provided with: a lowering device for lowering the gripping device 3 and causing the resin sheet material 2 gripped by the gripping frame 30 to approach the lower die 61; and a pair of bent posts 67, 68 which are provided on both Y-direction sides of the lower die 61, and which come in contact with portions of the gripping frame 30 when the gripping device 3 is lowered, and which convexly bend the gripping frame 30 upward as viewed from the side along the Y-direction.
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