Method for manufacturing semiconductor device
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United States of America Patent
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Jul 14, 2009
Grant Date -
Nov 22, 2007
app pub date -
Dec 29, 2006
filing date -
May 17, 2006
priority date (Note) -
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Abstract
A method for forming a semiconductor device includes forming a bit line contact region with a line pattern and then performing a process to form a bit line so that a multi-layered bit line contact is expended, thereby preventing a short between bit line contact plugs and improving the process margin of semiconductor devices and the reliability of semiconductor devices.
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