Method for forming embedded grounding planes on interconnect layers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11791228
APP PUB NO 20200328131A1
SERIAL NO

16380486

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Abstract

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Embodiments disclosed herein include electronic packages with a ground plate embedded in the solder resist that extends over signal traces. In an embodiment, the electronic package comprises a substrate layer, a trace over the substrate layer, and a first pad over the substrate layer. In an embodiment, a solder resist is disposed over the trace and the first pad. In an embodiment a trench is formed into the solder resist, and the trench extends over the trace. In an embodiment, a conductive plate is disposed in the trench, and is electrically coupled to the first pad by a via that extends from a bottom surface of the trench through the solder resist.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Darmawikarta, Kristof Chandler, US 140 138
Dittler, Roy Chandler, US 7 1
Ecton, Jeremy Gilbert, US 43 18
Grujicic, Darko Chandler, US 29 5
Marin, Brandon C Chandler, US 95 24

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