Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11538782
APP PUB NO 20210320077A1
SERIAL NO

17108140

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a semiconductor device comprising a semiconductor substrate, an under-bump pattern on the semiconductor substrate and including a first metal, a bump pattern on the under-bump pattern, and an organic dielectric layer on the semiconductor substrate and in contact with a sidewall of the bump pattern. The bump pattern includes a support pattern in contact with the under-bump pattern and having a first width, and a solder pillar pattern on the support pattern and having a second width. The first width is greater than the second width. The support pattern includes at least one of a solder material and an intermetallic compound (IMC). The intermetallic compound includes the first metal and the solder material.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moon, Kwangjin Hwaseong-si, KR 66 188
Park, Myungjoo Pohang-si, KR 8 8
Park, Sujeong Hwaseong-si, KR 9 10
Seo, Jubin Seongnam-si, KR 9 18

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