Dual sided lithographic substrate imaging
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United States of America Patent
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Nov 7, 2006
Issued Date -
N/A
app pub date -
Nov 24, 2004
filing date -
Dec 20, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device manufacturing method capable of imaging structures on both sides of a substrate, is presented herein. One embodiment of the present invention comprises a device manufacturing method that etches reversed alignment markers on a first side of a substrate to a depth of 10 .mu.m, the substrate is flipped over, and bonded to a carrier wafer and then lapped or ground to a thickness of 10 .mu.m to reveal the reversed alignment markers as normal alignment markers. The reversed alignment markers may comprise normal alignment patterns overlaid with mirror imaged alignment patterns.
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