Leadframe based memory card
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United States of America Patent
Stats
-
Aug 22, 2006
Grant Date -
N/A
app pub date -
May 1, 2003
filing date -
May 1, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A media card comprising a leadframe having first and second die pads, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts towards the first and second die pads. The second die pad is bent in a manner facilitating the formation of a cavity therein. Attached to the first die pad is a semiconductor die which is electrically connected to the leadframe. Disposed within the cavity and electrically connected to the leadframe is an electronic component. A body at least partially encapsulates the leadframe, the semiconductor die and the electronic component such that the contacts are exposed in the bottom surface defined by the body. The electronic component is shielded from radio frequency as a result of its receipt into the cavity defined by the second die pad of the lead frame.
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