Method for surface treatment of copper or copper alloys
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United States of America Patent
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Aug 22, 2000
Grant Date -
N/A
app pub date -
Jul 16, 1998
filing date -
Jul 24, 1997
priority date (Note) -
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Abstract
A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.
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