Suspension arrangement for semiconductor accelerometer
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United States of America Patent
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-
May 1, 2001
Grant Date -
N/A
app pub date -
Jun 18, 1997
filing date -
Jun 18, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A suspension mounting arrangement for a suspended layer in a semiconductor accelerometer, the layer being suspended above and spaced apart from a substrate. The arrangement includes a common anchor point associated with the substrate; first and second anchor points associated with the suspended layer; a first flexible serpentine arm coupled between the first anchor point and the common anchor point; and a second flexible serpentine arm coupled between the second anchor point and the common anchor point. The first and second flexible serpentine arms are symmetrically configured with respect to one another.
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