Method for forming a ball in wire bonding
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United States of America Patent
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-
Sep 28, 1999
Grant Date -
N/A
app pub date -
Oct 17, 1997
filing date -
Oct 17, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a fixed type discharge electrode system employed for forming a ball on a bonding wire so that a discharge electrode is provided near the tip end of a bonding wire, a gas, such as air, is blown to the spark discharged between the discharge electrode and the tip end of the bonding wire in the direction from the discharge electrode so as to bend the discharged spark and the discharged spark that faces the bonding wire is positioned beneath the bonding wire.
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