High density microwave hermetic interconnects for quantum applications

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United States of America Patent

PATENT NO 11900217
APP PUB NO 20230252332A1
SERIAL NO

18055435

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bronn, Nicholas T Long Island City, US 15 52
Gumann, Patryk Tarrytown, US 76 87
Hart, Sean Tarrytown, US 57 176
Olivadese, Salvatore B Stamford, US 19 23

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