Resin composition and molding method thereof

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United States of America Patent

PATENT NO 11807751
APP PUB NO 20200270430A1
SERIAL NO

16704226

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Abstract

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A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.

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Patent Owner(s)

  • HEMICELLULOSE LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kusumawardhani, Laksmi Tokyo, JP 2 1
Morita, Seiji Tokyo, JP 241 1344
Nasukawa, Jin Tokyo, JP 2 1
Sato, Kenichi Tokyo, JP 356 4294

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