Method for bonding copper-containing surfaces together
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United States of America Patent
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Aug 11, 1998
Grant Date -
N/A
app pub date -
Feb 28, 1997
filing date -
Feb 28, 1997
priority date (Note) -
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Abstract
Two copper containing surfaces are bonded together by microetching at least one of the surfaces, followed by abutting the two surfaces together, and then laminating them at a temperature of at least about 300.degree. C. and below the decomposition temperature of the copper-containing surfaces, and at a pressure of at least about 1500 psi.
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