Method for arranging minute metallic balls
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United States of America Patent
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Nov 2, 1999
Grant Date -
N/A
app pub date -
Jun 17, 1998
filing date -
Jun 18, 1997
priority date (Note) -
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Abstract
A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free from cohesion caused by electrostatic charge or moisture. The template may be inclined in the ethanol. The holes are formed by anisotropic etching a silicon plate.
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