Method of fabricating a built-in chip type substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 31, 2007
Grant Date -
Dec 1, 2005
app pub date -
May 31, 2005
filing date -
May 31, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of fabricating a built-in chip type substrate containing a semiconductor chip is disclosed. The method comprises a first step of mounting the semiconductor chip on a substrate; a second step of forming chip connection wiring connected to the semiconductor chip mounted on the substrate; and a step of forming an alignment post on the substrate before the first step, the alignment post being used for positioning the chip connection wiring.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully