Bonding method and bonding device for flexible panel

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United States of America Patent

PATENT NO 11931993
APP PUB NO 20220314591A1
SERIAL NO

17639151

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Abstract

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A bonding method and a bonding device for a flexible panel. In the process of bonding a protective cover plate and the flexible panel, a heated-type optical adhesive is used, the optical adhesive at normal temperature has relatively low viscosity and the viscosity thereof is below a bondable threshold, so that before the flexible panel and the edge of the protective cover plate are bonded, the optical adhesive and the edge of the protective cover plate come into contact in advance and then can be effectively separated, thus poor bonding in a bending region is avoided, the risk of generating bubbles and cracks is small, and the bonding yield can be improved. Moreover, the optical adhesive is increased in viscosity after heated, thereby ensuring that the flexible panel is bonded to the protective cover plate.

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Patent Owner(s)

  • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deng, Jia Beijing, CN 21 177
Fan, Rongkun Beijing, CN 8 0
Ma, Senlin Beijing, CN 4 2
Meng, Xue Beijing, CN 2 16
Qin, Chaoxue Beijing, CN 5 0
Wang, Jialin Beijing, CN 18 9
Wang, Peng Beijing, CN 1118 5529
Wen, Yuanhong Beijing, CN 4 1
Wu, Shengqiang Beijing, CN 2 0

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