Circuit substrate

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United States of America Patent

PATENT NO 9532467
APP PUB NO 20140000953A1
SERIAL NO

14020104

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and covers the first patterned conductive layer, wherein the dielectric layer has an opening and the first pad is exposed by the opening. The conductive block is disposed in the opening and covers the first pad. The second patterned conductive layer is disposed on a surface of the dielectric layer and has a second pad, wherein the second pad and the conductive block are integrally formed.

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Patent Owner(s)

  • VIA TECHNOLOGIES, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kung, Chen-Yueh New Taipei, TW 26 185

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