Cooling module and a method of assembling the cooling module to an electronic circuit module

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United States of America Patent

PATENT NO 11800682
APP PUB NO 20230180432A1
SERIAL NO

17541477

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Abstract

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Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

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Patent Owner(s)

  • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cader, Tahir Liberty Lake, US 126 768
Lunsman, Harvey J Chippewa Falls, US 28 44

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