CMP slurry composition for copper films and method of polishing copper films using the same

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United States of America Patent

PATENT NO 11746258
SERIAL NO

17072385

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Abstract

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A CMP slurry composition for copper films and a method of polishing a copper film using the same are disclosed, the composition including a polar solvent or a non-polar solvent; and polishing particles modified with a silicon-containing compound, wherein the silicon-containing compound is represented by Formula 1,

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Patent Owner(s)

  • SAMSUNG SDI CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Keun Sam Suwon-si, KR 1 0
Kang, Dong Hun Suwon-si, KR 34 185
Kim, Hyeong Mook Suwon-si, KR 3 0
Lee, Jong Won Suwon-si, KR 175 1349

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