Forming interconnect structures using pre-ink-printed sheets

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United States of America Patent

PATENT NO 8716867
APP PUB NO 20110277655A1
SERIAL NO

12778867

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Abstract

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A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiou, Wen-Chih Miaoli, TW 395 8133
Hou, Shang-Yun Jubei, TW 249 8137
Hsieh, Chi-Chun Tongluo Township, TW 10 67
Jeng, Shin-Puu Hsin-Chu, TW 754 15808
Ko, Francis Taichung, TW 19 299
Yu, Chen-Hua Hsin-Chu, TW 2036 41095

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