Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards
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United States of America Patent
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Dec 2, 1986
Issued Date -
N/A
app pub date -
Mar 26, 1985
filing date -
Apr 30, 1984
priority date (Note) -
Expired
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Abstract
A novel plating bath for plating nickel/indium alloys, which bath contains one or more buffer/chelating agents such as citric acid and citrate salts, and alloys plated from such baths which have utility in electrical applications.
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