Deformable die for use with sealant pads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 30, 1991
Grant Date -
N/A
app pub date -
Sep 22, 1989
filing date -
Sep 22, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Die plates for forming moisture seals about the junctions of wire harnesses afford improved wire separation and contact between the sealant material in a sealant pad and the wires if the opposed die plates have an elastomeric surface, and the opposed surface of at least one plate is radiused causing the sealant material to separate the wires and flow between and around each wire.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully