Flexible printed circuit and manufacturing method thereof, electronic device module and electronic device
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United States of America Patent
Stats
-
Aug 16, 2022
Grant Date -
Jul 15, 2021
app pub date -
Jan 23, 2020
filing date -
Jan 30, 2019
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively.
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