Chip package structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11855039
APP PUB NO 20220384364A1
SERIAL NO

17884200

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer and having a first portion and a second portion. The chip package structure includes a conductive bump over the second portion of the conductive pad. A third portion of the conductive pad is between the conductive bump and the conductive via structure from a top view of the conductive pad, the conductive bump, and the conductive via structure.

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First Claim

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Jung-Hua Hsinchu, TW 47 103
Huang, Cheng-Lin Hsinchu, TW 115 1262
Li, Ling-Wei Hsinchu, TW 14 9

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